发明名称 Apparatus of depositing thin film with high uniformity
摘要 A deposition apparatus of depositing deposition material on a wafer in a vacuum chamber includes a deposition boat installed in the vacuum chamber to vaporize the deposition material, a wafer guide on which the wafer is loaded, the wafer guide having a rotational member rotating together with the wafer, a wafer-rotation device rotating the rotational member when the wafer guide approaches, and a wafer-transfer device reciprocating the wafer guide between an inlet of the vacuum chamber, the deposition boat and the wafer-rotation device.
申请公布号 US6966952(B2) 申请公布日期 2005.11.22
申请号 US20040910417 申请日期 2004.08.04
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM YOUNG-EAL;CHOI SANG-JUN;MA DONG-JOON
分类号 C23C14/24;C23C14/00;C23C14/50;C23C16/00;H01L21/68;H01L21/687;(IPC1-7):C23C14/00 主分类号 C23C14/24
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