Light emitting semiconductor package

摘要

A light emitting semiconductor package ( 250 ) has a semiconductor chip ( 252 ) with a surface with one or more light emitting devices ( 254 ) formed on or in the surface. A cap ( 256 ) is bonded to the surface of the chip ( 252 ) to encapsulate the devices ( 254 ). The cap has one or more regions ( 258 ) transparent to light emitted by the light emitting devices ( 254 ). The cap has been bonded to the semiconductor chip ( 252 ) at the wafer stage prior to separation of the wafer into individual packages.