发明名称 POWDER MOLDING DIE APPARATUS AND METHOD OF MOLDING FOR OBTAINING POWDER MOLDING PRODUCT
摘要 Surface treatment layer (11) is formed on surface (10) of through-hole (1) so that the surface (10) has an angle (X) of contact with solution (L) which is smaller than an angle (Y) of contact of die (2) per se with solution (L). Thus, at application of solution (L), the wetting of through-hole (1) with solution (L) is increased, so that the solution (L) can be extended over the surface treatment layer (11), namely, the entire surface of the through-hole (1). Consequently, the entire surface can be provided with a crystallization layer by performing water evaporation. As a result, molding at higher temperature can be realized, and high-density powder molding products can be stably obtained. Furthermore, a crystallization layer can be formed by applying solution (L) having a lubricant dissolved in a solvent into a homogeneous phase to molding part (1A) and evaporating the solution (L) to thereby effect crystallization on the molding part.
申请公布号 KR20050109479(A) 申请公布日期 2005.11.21
申请号 KR20057014413 申请日期 2005.08.04
申请人 MITSUBISHI MATERIALS CORP. 发明人 NAKAI TAKASHI;KAWASE KINYA
分类号 B30B11/00;B22F3/02;B22F3/03;B22F3/035;B30B11/02;B30B15/00;(IPC1-7):B30B11/00 主分类号 B30B11/00
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