| 摘要 |
A film-forming apparatus component having a structure that enables to separate an adherent film (d) formed on the component in a shorter time than conventional and to reduce damages caused by a cleaning liquid (S) is disclosed. A method for cleaning such a component is also disclosed. On the surface of a base- material metal (1) of the component is formed a metal film layer (2) which is electrochemically baser than the base-material metal (1) by a method such as spraying, deposition, sputtering, lamination or the like; or a second metal film layer (3) which is electrochemically more noble than the base-material metal (1) is formed on the surface of the metal film layer (2) by the above-mentioned method such as spraying. Consequently, a local cell is formed between the metal film layer (2) and the base-material metal (1) or between the metal film layer (2) and the second metal film layer (3), thereby enabling to separate an adherent film (d) deposited on the base-material metal (1) in a considerably short time without having the base-material metal (1) itself suffer from damages caused by a cleaning liquid (S). |
