| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly flexible resin which can be used in the application of materials for the electrical/electronic field capable of giving cured products excellent in the balance of adhesion, flexibility, and electrical properties, adhesives and the like, and its highly flexible resin cured product. SOLUTION: The highly flexible resin is obtained by reacting a difunctional aliphatic epoxy compound (X) having a purity of the diglycidyl material obtained by the distillation purification of a reaction product of a 2-12C divalent alcohol with an epihalohydrin of≥90 mass% and total chlorines of≤0.3 mass% with a divalent phenolic compound (Y) in the presence of a catalyst, and has a number average molecular weight of 300-100,000. A curable resin composition contains the highly flexible resin, and the cured product is obtained by curing the curable resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
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