Titanium-copper alloy having excellent conductivity and method of producing the same

摘要

The present invention provides a titanium-copper alloy having high strength and excellent conductivity as a copper alloy comprising: three to four percent by mass of Ti, residual Cu, and inevitable impurities, wherein the area percentage (S(%)) of a Cu-Ti intermetallic compound phase observed in a section perpendicular to the rolling direction is represented by the following formula: <?in-line-formulae description="In-line Formulae" end="lead"?>S(%)>=8.1x[Ti]-17.7 <?in-line-formulae description="In-line Formulae" end="tail"?> where [Ti] represents the Ti content in percent by mass. A method for producing the same is also provided.