Single wafer cleaning apparatus and cleaning method thereof

摘要

A single wafer cleaning method and a cleaning apparatus thereof are provided in which the transition to rinse treatment is swiftly performed without being influenced by a chemical liquid component, and a polymer and a residue of chemical liquid are suppressed to reduce defects on a substrate. The single wafer cleaning method according to an embodiment of the present invention is a single wafer cleaning method of performing cleaning by a chemical liquid 8 and a rinse liquid 14 while rotating a substrate-to-be-cleaned 30, in which after chemical liquid treatment is performed by moving a chemical liquid nozzle 10 over the substrate-to-be-cleaned 30, rinse treatment is performed on the substrate-to-be-cleaned 30 by discharging the rinse liquid 14 from a rinse nozzle 16 disposed fixedly at a position not interfering with the movement of the chemical liquid nozzle 10.