| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide the manufacturing method of a wiring board by which a resist layer for forming a bump is removed without causing damage to a solder resist layer, reliability of a module product is secured, and a time of a process is shortened by devising reflow processing of metal for forming the bump. <P>SOLUTION: The manufacturing method includes steps of forming a first hole 13 which communicates with an electrode (not illustrated) formed on a substrate 11 on the solder resist layer 12 formed on the substrate 11, forming the resist layer 14 for forming the bump on the solder resist layer 12, forming a second hole 15 for forming the bump at the resist layer 14 for forming the bump on the first hole 13, including a process to fill the metal 21 for forming the bump to implant in the first hole 13 and the second hole 15, applying heat treatment of the metal 21 for forming the bump at such temperature as the metal 21 for forming the bump is fused and cracks are caused only at the resist layer 14 for forming the bump, and then peeling off the resist layer 14 for forming the bump from the upward part of the solder resist layer 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
