| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component having an external connection electrode, having the external connection electrode which hardly causes the ion migration of the metal of a base layer even if it is mounted to a printed circuit board, applied of a voltage, and used over a long period, and to provide a circuit module which uses the same. SOLUTION: The intermediate plated layer of an external connection electrode, having a base layer (b), the intermediate plated layer (c), and a surface layer (d) containing tin is, extended from the end of the edge of the base layer. The base layer is covered with the intermediate plated layer. The length h<SB>1</SB>of a perpendicular line, relative to a ceramic body at an end position in the periphery of the edge of the base layer to the contact surface of the intermediate plated layer and the surface layer, is set to be 0.9 times long as or shorter than the length h<SB>2</SB>of a perpendicular line, relative to the ceramic body at a position apart to an end side from the end position in the periphery of the edge of the base layer by the length of the extended width of the intermediate plated layer. A circuit module is connected to an electronic component, having the external connection electrode through soldering. COPYRIGHT: (C)2006,JPO&NCIPI
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