| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition having a reduced variation in bonding strength and a reliable semiconductor device using the resin composition for a die attach material or a heatsink attach material for the semiconductor. SOLUTION: The resin composition contains (A) a radical polymerization initiator with a molecular weight of≥1,500, (B) a compound having a structure expressed by general formula (1) (R<SP>1</SP>: a 3-6C hydrocarbon group) in the skeleton of the main chain and at least two radical-polymerizable carbon-carbon unsaturated bonds and (C) a filler as the indispensable components. Preferably, Component (A) has a structure expressed by general formula (2) (R<SP>2</SP>: an organic group). COPYRIGHT: (C)2006,JPO&NCIPI
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