发明名称 Coil component
摘要 The invention relates to surface-mount coil component including a mount surface mounted on a printed circuit board or a hybrid IC (HIC), and provides a small and low-profile coil component excellent in impedance characteristic. The coil component includes coil conductors each of which includes a major wiring region having the number N of wiring lines and a minor wiring region arranged to be opposite to the major wiring region and having the number (N-1) of wiring lines, and is arranged so that a major wiring side interval as an interval between an outermost periphery of the major wiring region and one side part of the substrate opposite thereto is longer than a minor wiring side interval as an interval between an outermost periphery of the minor wiring region and the other side part of the substrate opposite thereto.
申请公布号 US2005253677(A1) 申请公布日期 2005.11.17
申请号 US20050113092 申请日期 2005.04.25
申请人 TDK CORPORATION 发明人 ITO TOMOKAZU;KUDO TAKASHI;OTOMO MAKOTO
分类号 H01F5/00;H01F17/00;H01F27/28;(IPC1-7):H01F5/00 主分类号 H01F5/00
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