发明名称 Semiconductor device
摘要 One of the aspects of the present invention is to provide a semiconductor device, which includes a semiconductor layer of a first conductive type having first and second surfaces. The semiconductor layer includes a base region of a second conductive type formed in the first surface and an emitter region of the first conductive type formed in the base region. Also, the semiconductor device includes a buffer layer of the first conductive type formed on the second surface of the semiconductor layer, and a collector layer of the second conductive type formed on the buffer layer. The buffer layer has a maximal concentration of the first conductive type impurity therein of approximately 5x10<SUP>15 cm</SUP><SUP>-3 </SUP>or less, and the collector layer has a maximal concentration of the second conductive type impurity therein of approximately 1x10<SUP>17 cm</SUP><SUP>-3 </SUP>or more. Further, the ratio of the maximal concentration of the collector layer to the maximal concentration of the buffer layer being greater than 100. The collector layer has a thickness of approximately 1 mum or less.
申请公布号 US2005253169(A1) 申请公布日期 2005.11.17
申请号 US20050108694 申请日期 2005.04.19
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人 SUEKAWA EISUKE
分类号 H01L21/336;H01L29/06;H01L29/08;H01L29/43;H01L29/732;H01L29/739;H01L29/74;H01L29/76;H01L29/78;H01L31/0328;H01L31/0336;H01L31/072;H01L31/109;H01L31/111;(IPC1-7):H01L29/43;H01L31/032;H01L31/033 主分类号 H01L21/336
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