| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent the degradation of the humidity resistance of a semiconductor element under a use environment and dew condensation in the inner plane of a coated part, and also to prevent an entrance of water or foreign matters into a hollow part between the semiconductor element and the coated part in a subsequent step to a dicing step. <P>SOLUTION: An adhering part 5 is formed for adhering the main face of a solid-state imaging device 2 to a translucent coated part 4 and to constitute a hollow part 10 therebetween. The adhering part 5 is formed with a first opening end 7a on the side of the hollow part 10, a second opening end 7b on the outside, and a capture part 7c. A vent path 7 is constituted of the first opening end 7a, the capture part 7c and the second opening end 7b. The vent path 7 is shaped such that the first opening end 7a is not connected to the second opening end 7b in a straight line, but they are connected to each other in the adhering part 5 via the capture part 7c having a larger shape than the above shapes. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
