| 摘要 |
PROBLEM TO BE SOLVED: To provide a film molding resin composition excellent in transparency, rigidity, and heat resistance and to provide a film made therefrom. SOLUTION: The film molding resin composition comprises the following polypropylene resin composition (I) and 0.01 to 1 pt. wt., per 100 pts.wt. resin composition (I), polyethylene (C) having a density of at least 0.94 g/cm<SP>3</SP>and a melt flow rate of 5 to 30 g/10 min. The above polypropylene resin composition (I) comprises 70 to 99 pts.wt. polypropylene resin (A) having a die swell ratio of below 1.7 and 1 to 30 pts.wt. polypropylene resin (B) having a die swell ratio of at least 1.8. The film is made from the above composition. COPYRIGHT: (C)2006,JPO&NCIPI |
