发明名称 POLISHING SLURRY
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a polishing slurry for polishing metals that mainly consists of water and includes organic particles, an oxidant, and a complexing agent, and makes a rapid polishing while suppressing the occurrence of scratches, dishing, and erosion, and has suppressed foaming. <P>SOLUTION: The polishing slurry is used for polishing metals that contains the organic fine particles, the complexing agent, the oxidant, and an additive for suppressing foaming. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005322670(A) 申请公布日期 2005.11.17
申请号 JP20040137267 申请日期 2004.05.06
申请人 MITSUI CHEMICALS INC 发明人 SHINDO KIYOTAKA;ETO AKINORI;ISHIZUKA TOMOKAZU
分类号 B24B37/00;C09K3/14;H01L21/304;(IPC1-7):H01L21/304 主分类号 B24B37/00
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