COMPONENT BONDING DEVICE, TOOL, AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a component bonding device and a component bonding tool capable of stably bonding an intended large-size component. SOLUTION: In the component bonding tool used for the component bonding device for bonding the component to a board by applying a load and vibration to the component, two bonding operative parts 10 are arranged in a widthwise direction of a horn 8 and two vibrators 11 are coupled in parallel at an end of the horn 8 so as to fit the respective axis lines AL1, AL2 to a center of each bonding operative part 10, in order to hit and contact the bonding action part to the large and long semiconductor chip 4 with a necessary and sufficient hit-and-contact width. In the bonding operation, the two vibrators 11 are driven and synchronously vibrated by a vibrator driving part 14 to apply the vibration to the semiconductor chip 4 through the bonding operative part 10. This can stably bond the intended large component. COPYRIGHT: (C)2006,JPO&NCIPI