HEAT DISSIPATION PLATE FOR CSP, ITS MANUFACTURING METHOD, AND CHIP SIZE PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a heat dissipation plate for CSP capable of realizing higher heat dissipation property than prior art, and also to provide its manufacturing method and a chip size package (CSP). SOLUTION: A semiconductor chip 5 is mounted on the upper surface of the chip mounting part 2 of an aluminum-made heat dissipation plate 1, and a plurality of solder balls 6 are provided on the upper surface of the semiconductor chip 5. In contrast, one or more of aluminum bumps 4 integrally molded with the heat dissipation plate 1 are provided on the upper surface of the metal bump formation 3 of the heat dissipation plate 1. When the CSP constituted by them is mounted on a circuit board, the aluminum bump 4 serves to transmit heat produced in the semiconductor chip 5 to the circuit board by permitting the CSP to make contact with the circuit board via the aluminum bump 4 and the solder ball 6 in a surface direction where the solder ball 6 or the like is provided. COPYRIGHT: (C)2006,JPO&NCIPI