| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device to give no stress to a semiconductor chip, because, when an external electrode is connected to the electrode of the semiconductor chip after resin packaging, a packaging resin is adhered to the upper surface of the electrode of the semiconductor chip, and even after the packaging resin is removed from the upper surface thereof by cutting, the semiconductor chip may be damaged by stress generated at that time. SOLUTION: A surface-side protection insulated layer 5 is made of a photosensitive resin, and therefore, an opening hole 5a is formed on the upper portion of a surface electrode 2 by photolithography. As a result, the semiconductor chip 1a is hardly given any physical stress. COPYRIGHT: (C)2006,JPO&NCIPI
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