发明名称 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN AND ELECTRONIC COMPONENT USING SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition developable with an alkali and having excellent transmittance for rays in the i-line region from a mercury lamp, preferable sensitivity, developing property and preferable resolution. <P>SOLUTION: The positive photosensitive resin composition comprises at least a polybenzoxazole precursor having a structural unit expressed by general formula (1) and a compound which produces an acid by irradiation with radiation. In formula (1), X represents a bivalent organic group and each of two R independently represents a hydrogen atom or monovalent organic group. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005321466(A) 申请公布日期 2005.11.17
申请号 JP20040137583 申请日期 2004.05.06
申请人 HITACHI CHEM CO LTD;RIKOGAKU SHINKOKAI 发明人 MINEGISHI TOMONORI;IWASHITA KENICHI;UEDA MITSURU;TOYOKAWA IKUHIRO;ANDO SHINJI
分类号 G03F7/039;C08G73/22;G03F7/037;G03F7/40;H01L21/027 主分类号 G03F7/039
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