发明名称 |
POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING PATTERN AND ELECTRONIC COMPONENT USING SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition developable with an alkali and having excellent transmittance for rays in the i-line region from a mercury lamp, preferable sensitivity, developing property and preferable resolution. <P>SOLUTION: The positive photosensitive resin composition comprises at least a polybenzoxazole precursor having a structural unit expressed by general formula (1) and a compound which produces an acid by irradiation with radiation. In formula (1), X represents a bivalent organic group and each of two R independently represents a hydrogen atom or monovalent organic group. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005321466(A) |
申请公布日期 |
2005.11.17 |
申请号 |
JP20040137583 |
申请日期 |
2004.05.06 |
申请人 |
HITACHI CHEM CO LTD;RIKOGAKU SHINKOKAI |
发明人 |
MINEGISHI TOMONORI;IWASHITA KENICHI;UEDA MITSURU;TOYOKAWA IKUHIRO;ANDO SHINJI |
分类号 |
G03F7/039;C08G73/22;G03F7/037;G03F7/40;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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