| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film laminate used for a tape-automated bonding (TAB) method or a chip-on film (COF) method for mounting electronic parts which exhibits excellent adhesion between a polyimide film and a metal. SOLUTION: As the polyimide film, one comprised of a polyimide obtained by dehydrating imidation ring closure of a polyamic acid obtained from a tetracarboxylic dianhydride containing an alicyclic tetracarboxylic dianhydride compound having a specific tricyclic structure and a diamine is used. COPYRIGHT: (C)2006,JPO&NCIPI |
