| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having good curability, storability and fluidity, and a semiconductor device excellent in soldering crack resistance and reliability of moisture resistance. SOLUTION: The epoxy resin composition comprises (A) a compound having two or more epoxy groups in one molecule, (B) a compound having two or more phenolic hydroxy groups in one molecule, and (C) an organosilane compound represented by general formula (1). In formula (1), R<SP>1</SP>, R<SP>2</SP>and R<SP>3</SP>, which may be the same or different, indicate each any one of a 1-4C alkyl group, a 1-4C alkoxy group or a 6-12C aryl group; R<SP>4</SP>indicates a 1-6C hydrocarbon group; R<SP>5</SP>indicates an n-valent organic group; and n is an integer of 1-3. COPYRIGHT: (C)2006,JPO&NCIPI
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