Method of fabricating inlaid structure

摘要

A method of fabricating an inlaid structure. A sacrificial layer having a trench opening over a substrate is provided. A metal layer is deposited over the sacrificial layer filling the trench openings. A first CMP is performed to remove excess metal layer above the sacrificial layer to form an interconnect structure. The sacrificial layer is removed to expose the interconnect structure. A first dielectric layer is deposited over the substrate covering the interconnect structure. A second CMP is performed on the first dielectric layer to planarize the first dielectric layer.