摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device for jointing a base plate with a resin case without variation in thickness of an adhesive, while suppressing the manufacturing cost. SOLUTION: A protrusion 19 is formed on the base plate 1. The protrusion 19 is formed at a position, corresponding to a jointing face with the resin case 12. The resin case 12 and the base plate 1 are jointed via the adhesive 18. The tip of the protrusion 19 is brought into tight contact with the resin case 12, by further pressing the resin case 12 and the base plate 1 by a screw 16. As a result, the thickness of the adhesive 18 is kept fixed by the height of the protrusion 19. COPYRIGHT: (C)2006,JPO&NCIPI |