发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To suppress formation of abnormal oxides in the contact region of gate wiring. SOLUTION: A manufacturing method is provided for a semiconductor device having a field effect transistor. This method comprises the steps of forming a semiconductor film on the main surface of a semiconductor substrate, implanting ions of an impurity for reducing the resistance value of the semiconductor film, forming the wiring including the gate electrode and the contact region, forming a metal-semiconductor reaction layer on the surface of the wiring, forming an insulating film on the main surface of the semiconductor substrate to cover the wiring, and forming a connection hole on the contact region of the wiring by etching the insulating film. The impurity ion implantation step is carried out, in a state where the part of the semiconductor film to be the contact region of the wiring is covered with a mask. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005322730(A) 申请公布日期 2005.11.17
申请号 JP20040138550 申请日期 2004.05.07
申请人 RENESAS TECHNOLOGY CORP 发明人 FUNAYAMA KOTA;YOSHIDA YASUKO;YONEMOCHI YASUAKI;SATO KAZUHIKO;MIYATA MOTOMU;MATSUO NOBUYUKI;KOIDE KUNIHIRO
分类号 H01L21/768;H01L21/3205;H01L21/336;H01L21/8234;H01L21/8238;H01L23/52;H01L27/088;H01L27/092;H01L29/78;(IPC1-7):H01L21/823;H01L21/320;H01L21/823 主分类号 H01L21/768
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