| 摘要 |
PROBLEM TO BE SOLVED: To diminish an adverse effect caused by thermal expansion of a manifold, in an injection molding device which supplies a melt material to a nozzle arranged in a gate of a molding die through a runner of the manifold and injects the melt material into a cavity of the molding die through the nozzle. SOLUTION: In this injection molding device, a first manifold 5 located upstream in a melt material supply passage and a second manifold 6 which is located downstream from the first manifold 5 and connected with the nozzle 4, are provided. In addition, the joint surfaces of the first manifold 5 and the second manifold 6 are in parallel with the thermal expansion direction of the first manifold 5, and the coefficient of thermal expansion of the first manifold 5 is higher than that of the second manifold 6. Further, the second manifold 6 is fixed to the molding die 2 and the surface of the second manifold 6 is ceramic-coated. Also the injection molding method is provided. COPYRIGHT: (C)2006,JPO&NCIPI
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