发明名称 |
SEMICONDUCTOR COMPONENT PROVIDED WITH A REWIRING SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF |
摘要 |
The invention relates to a semiconductor component (10) provided with a rewiring substrate (1) in the form of a stack element for a semi-conductor component stack (25, 30, 35, 40). Said rewiring substrate (1) comprises a plastic frame (41) consisting of a first plastic compound (41) and a central area (20) comprising a second plastic compound (46). A semiconductor chip (6) is incorporated into in the second plastic material (46) by the rear (14) and lateral (12) faces thereof, wherein the active face of the semiconductor component (6) is embodied in the form of a surface (3) coplanar with the plastic compounds (42, 46). |
申请公布号 |
WO2005109499(A2) |
申请公布日期 |
2005.11.17 |
申请号 |
WO2005DE00840 |
申请日期 |
2005.05.03 |
申请人 |
INFINEON TECHNOLOGIES AG;BAUER, MICHAEL;FUERGUT, EDWARD;JEREBIC, SIMON;WOERNER, HOLGER |
发明人 |
BAUER, MICHAEL;FUERGUT, EDWARD;JEREBIC, SIMON;WOERNER, HOLGER |
分类号 |
H01L23/538;H01L25/065;H01L25/10 |
主分类号 |
H01L23/538 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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