发明名称 SEMICONDUCTOR COMPONENT PROVIDED WITH A REWIRING SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF
摘要 The invention relates to a semiconductor component (10) provided with a rewiring substrate (1) in the form of a stack element for a semi-conductor component stack (25, 30, 35, 40). Said rewiring substrate (1) comprises a plastic frame (41) consisting of a first plastic compound (41) and a central area (20) comprising a second plastic compound (46). A semiconductor chip (6) is incorporated into in the second plastic material (46) by the rear (14) and lateral (12) faces thereof, wherein the active face of the semiconductor component (6) is embodied in the form of a surface (3) coplanar with the plastic compounds (42, 46).
申请公布号 WO2005109499(A2) 申请公布日期 2005.11.17
申请号 WO2005DE00840 申请日期 2005.05.03
申请人 INFINEON TECHNOLOGIES AG;BAUER, MICHAEL;FUERGUT, EDWARD;JEREBIC, SIMON;WOERNER, HOLGER 发明人 BAUER, MICHAEL;FUERGUT, EDWARD;JEREBIC, SIMON;WOERNER, HOLGER
分类号 H01L23/538;H01L25/065;H01L25/10 主分类号 H01L23/538
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