| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor sealing resin composition having a long pot life, excellent humidity resistance, and excellent solderability and is desirably used in a method for producing by a no-flow system a semiconductor device composed of a wiring board substrate and a bumped semiconductor element attached thereto in a face-down manner. SOLUTION: The semiconductor sealing resin composition is used in the no-flow system production of a semiconductor device and comprises (A) an epoxy resin having at least two epoxy groups in the molecule, (B) a phenolic resin having at least two hydroxyl groups in the molecule, (C) a flux activator, and (D) a cure accelerator represented by formula (I) (wherein X<SB>1</SB>to X<SB>5</SB>are each hydrogen, a 1 to 9C alkyl group, or fluorine, provided that they may be same or different from each other) and having a particle diameter distribution in which the maximum particle diameter is 30μm or smaller, and the weighted standard deviation of characteristic particle diameters is 5μm or smaller. COPYRIGHT: (C)2006,JPO&NCIPI
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