发明名称 |
LED bonding structures and methods of fabricating LED bonding structures |
摘要 |
An LED chip includes a bond pad suitable for thermosonic or thermocompression bonding such as Sn, AuSn or other metals. The physical dimensions of the bond pad are selected to discourage or prevent solder squeeze-out during thermocompression or thermosonic bonding with or without flux. In some embodiments, an AuSn bond pad is designed to accept 30 g to 70 g of force or more without squeeze-out.
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申请公布号 |
US2005253154(A1) |
申请公布日期 |
2005.11.17 |
申请号 |
US20050114639 |
申请日期 |
2005.04.26 |
申请人 |
SLATER DAVID B JR;EDMOND JOHN A |
发明人 |
SLATER DAVID B.JR.;EDMOND JOHN A. |
分类号 |
G01N33/68;H01L27/15;H01L33/38;H01L33/40;H01L33/62;(IPC1-7):H01L27/15 |
主分类号 |
G01N33/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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