发明名称 |
Multiple exposure and shrink to achieve reduced dimensions |
摘要 |
The embodiments of the present invention include decomposing a pattern into dependent patterns. The dependent patterns may then be transferred to a semiconductor wafer surface and the pattern's features may be shrunk. The shrunk features may be transferred to the substrate. The multiple exposures and shrinks facilitate smaller feature dimensions.
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申请公布号 |
US2005255411(A1) |
申请公布日期 |
2005.11.17 |
申请号 |
US20040846616 |
申请日期 |
2004.05.14 |
申请人 |
FROST REX;SIVAKUMAR SWAMINATHAN |
发明人 |
FROST REX;SIVAKUMAR SWAMINATHAN |
分类号 |
G03F7/00;G03F7/40;(IPC1-7):G03F7/00 |
主分类号 |
G03F7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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