| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a technology for simplifying condition setting for inspecting an unpolished part in inspecting a thin film device. <P>SOLUTION: Focusing not on envelopes 63 of spectral reflectance data but on vibration center components 91 of the spectral reflectance data, when the unpolished part is thick, detection of the unpolished part and computing/condition setting of the film thickness of the unpolished part are carried out utilizing that the vibration center components 91 of the spectral reflectance data on the surface of a sample gradually approach the surface reflectance 81 of a material itself still with the unpolished part eventually. The film thickness of the unpolished part can be evaluated without evaluating the relation between the appearance amount of data outside of a region surrounded by the envelopes 63, and the film thickness of the unpolished part beforehand. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
