| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which has superior moisture resistance and water resistance and is capable of preventing shorts between wiring patterns, a method of forming the same, and to provide a film mask used for the method for forming the wiring board. SOLUTION: The method of forming the wiring board 100 is to cover the wiring patterns 130 which are composed of an electrically conductive resin and are formed on a terminal part 110 of a board 120, with covering conductors 150, composed of an electrically conductive resin containing carbon grains by using a film mask for forming the wiring board. With this method, the surfaces 170 of the covering conductors 150 are planarized, and their side faces 160 are made to be of a sharp shape for realizing contact resistance reduction and miniaturization of the wiring patterns 130. Furthermore, migration of the wiring patterns 130 is prevented by the covering conductors 150, and shorts between neighboring covering conductors 150 are prevented, thus realizing a high reliability wiring board. COPYRIGHT: (C)2006,JPO&NCIPI
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