| 摘要 |
PROBLEM TO BE SOLVED: To provide a both-surface wiring board and its manufacturing method, wherein the both-surface wiring board is miniaturized, a heat resistance, airtightness, reliability, and a mass-productivity are excellent. SOLUTION: This method comprises: the first step of forming a through hole 3 in a board 1, to adhere Cu or an alloy containing Cu to the side wall of the through hole 3 with leaving an opening gap interconnected with both surfaces of the board at the center of the through hole; the second step of adhering Sn or an alloy containing Sn to a surface of Cu or the alloy containing Cu adhered to the side wall of the through hole 3, to be filled in the opening gap; and the third step of forming a diffusion alloy mutually by a thermal treatment, with Cu or the alloy containing Cu adhered in the first step and Sn or the alloy containing Sn adhered and filled in the second step. Thus, a both-surface wiring board 10 in which wiring layers 2a, 2b formed on both surfaces of the board 1 are electrically connected to each other, is obtained. COPYRIGHT: (C)2006,JPO&NCIPI
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