| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermoelectric transducing module that prevents a semiconductor from cracking, by preventing thermal stress from being generated at a jointing part between the semiconductor and an electrode constituting a thermoelectric element. SOLUTION: The thermoelectric transducing module 10 is provided between a high-temperature side 1st heat conductor 11 and a low-temperature side 2nd heat conductor 11a opposite to each other on one main surface of a cylindrical plane body. A plural sets of thermoelectric elements 12 are formed, by arranging a pair of a columnar or prismatic p-type semiconductor 13 and n-type semiconductor 13a side by side. The sets of the thermoelectric elements 12 are connected in series, via a high-temperature side electrode 14 and a low-temperature side 2nd electrode 14a. The 2nd heat conductor 11a has a through hole 15 on one main surface and the 2nd electrode 14a has an O-ring 16 on its outer peripheral wall, the 2nd electrode 14a engaged with and jointed to the wall surface of the through hole 15 of the 2nd heat conductor 11a via the O-ring 16. COPYRIGHT: (C)2006,JPO&NCIPI
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