| 摘要 |
A semiconductor device includes a rectangular chip having four sides, wires connected respectively to different external terminals, and a bonding pad disposed along one of the four sides of the rectangular chip and directly connected to the wires for connection to the different external terminals. Since the different external terminals are bonded directly to the bonding pad by the wires, a signal input from one of the external terminals via one of the wires can be sent to the other external terminal via the other wire.
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