| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board in which a noise reduction effect is more improved for a packaging component having multiple terminals. <P>SOLUTION: A circuit board constructed by stacking at least two or more layers through an insulating layer is formed with a first ground pattern which is formed on a bottom side of a circuit component; a second ground pattern which is formed separately around the first ground pattern; a third ground pattern which is formed in the layer different from the layers of the first ground pattern and of the second ground pattern; and a via hole for conducting the first ground pattern, the second ground pattern, and the third ground pattern, respectively. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
