| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a ceramic substrate capable of avoiding substrate deformation by suppressing a firing shrinkage difference, with respect to a ceramic substrate used for manufacturing various kinds of ceramic electronic parts; and to provide its manufacturing method. <P>SOLUTION: The ceramic substrate 1 has dummy patterns 31, 32 on both the outsides of an element formation region 2. Generally, the dummy patterns 31, 32 are conductor films. The base substrate 1 is preferably composed of a low-temperature simultaneous calcination ceramics material. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
