发明名称 SPLICING MACHINE
摘要 PROBLEM TO BE SOLVED: To correct an irradiation position of energy beams to melt and splice electronic components even when a board is misaligned largely from a specified position to dispose the board to be soldered. SOLUTION: A splicing machine is used for irradiating energy beams on the board having a plurality of positioning marks to melt and splice electronic components, and comprises an accepting means for accepting positions of the positioning marks of the board disposed in a specified position and the irradiating position of energy beams, respectively, a position specifying means for specifying the position of the positioning mark based on an image of the imaged board, a calculating means for calculating an offset with respect to the positions of the plurality of positioning marks accepted by the accepting means, of the positions of the plurality of positioning marks specified by the position specifying means, and an updating means of updating the irradiation position accepted by the accepting means by using the calculated offset. The construction is made to irradiate energy beams on the updated irradiation position. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005322806(A) 申请公布日期 2005.11.17
申请号 JP20040140250 申请日期 2004.05.10
申请人 KOYO SEIKO CO LTD 发明人 OTSUKA SHINTA;KAJITANI MASASHI;KAOKU TAKASHI
分类号 B23K1/00;B23K1/005;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/00
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