| 摘要 |
PROBLEM TO BE SOLVED: To provide a high quality semiconductor device in a flip chip system and a wiring board, with which adhesiveness of the interface of the wiring board and sealing resin can be raised and the interface is not peeled on mounting in high temperature of lead-free solder without cost rise. SOLUTION: In the wiring board 1 in which a semiconductor element 6 is flip-chip mounted, dummy vias 8 are formed where a region mounting the semiconductor element 6 is not filled with conductive paste 3, and adhesiveness of the wiring board 1 and sealing resin 9 is improved by filling the dummy vias 8 with sealing resin 9. Thus, (1) use regulation of an environmental load burden substance becomes strong, and use of lead-free solder in which lead acting as the environmental load substance is not used is spread in solder used when an electronic component is mounted. (2) Since a melting temperature of lead free solder is high compared to conventional lead solder, the electronic component in which a quality problem such as peeling of the interface between a semiconductor carrier and sealing resin is not caused at the time of mounting the electronic component where the problem is solved that the mounting temperature of the electronic material becomes high. COPYRIGHT: (C)2006,JPO&NCIPI |
