| 摘要 |
PROBLEM TO BE SOLVED: To provide a pore generating type resinoid grinding wheel advantageously usable for grinding a workpiece such as a silicon wafer requiring high machining accuracy while suppressing swelling by water absorption of a pore generating agent. SOLUTION: This pore generating type resinoid grinding wheel contains an abrasive material and an inorganic solid bound by an inorganic binder, wherein the inorganic solid is formed as a granulating body of fine grains, and coating treatment is applied to the outer periphery of the fine grain granulating body. Preferably, coating treatment is applied also to the side face of a grinding wheel polishing surface. COPYRIGHT: (C)2006,JPO&NCIPI
|
