发明名称 HEATER CHIP FOR THERMOCOMPESSION BONDING
摘要 PROBLEM TO BE SOLVED: To provide a heater chip for thermocompression bonding capable of eliminating the possibilities of separation of a thermometry part of a thermocouple and breakage of leads by heating and vibration. SOLUTION: A set of power terminal parts, a heat-pressure welded part heated by an energization resistance, and a part for a thermocouple for temperature control are provided on a small plate piece manufactured by forging tungsten alloy etc. A cutout part for inserting the connection end part of the thermocouple is recess-formed near the heat-pressure welded part starting from an edge part of the small plate piece. A thermometry part formed by thermally fusing the connected end part is fitted to the small plate piece so as to cover a side end face of the small plate piece and a mouth edge part of the cut-in part. A slit is formed in the small plate piece to form a U-shaped energization path. A bridge member formed of an electric insulator is attached in a joined condition to a cut-out groove across and near a release end of the slit to increase the structural strength of the small plate piece. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005319468(A) 申请公布日期 2005.11.17
申请号 JP20020139566 申请日期 2002.05.15
申请人 KOBO PDA CO LTD 发明人 ISHII TATSUYA
分类号 B23K3/03;B23K3/04;B23K3/047;(IPC1-7):B23K3/047 主分类号 B23K3/03
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