| 摘要 |
<p>Certain hermetically sealed devices, such as micro-electromechanical systems (MEMS), may be sensitive high processing temperatures. However, the seal should be able to withstand higher temperatures that may be encountered, for example during device operation. Hermetic sealing may be realized by a fluxless soldering approach that comprises solder combinations that contain a low-melting-point (LMP) component such as Indium (In) or Tin (Sn) and a high-melting-point (HMP) component such as gold (Au), silver (Ag), or copper (Cu). The LMP/HMP ratio is selected to be HMP component rich so that the LMP component is essentially depleted resulting in an intermetallic compound (IMC) that has a higher melting point than the original HMP/LMP processing temperature after bonding and thermal annealing.</p> |
