| 摘要 |
<p>The present invention provides a method of soldering using a soft beam to connect a first collimator and a second collimator with the housing, respectively, the housing having both ends being penetrated, the method comprising the steps of inserting the first collimator in one end of the housing; supplying solder at a contact portion where the inner circumferential surface of the housing meets the outer circumferential surface of the first collimator; soldering the housing and the first collimator by irradiating a soft beam to the solder; inserting the second collimator in the other end of the housing so that the second collimator is separated from the first collimator; supplying solder at a contact portion where the inner circumferential surface of the housing meets the outer circumferential surface of the second collimator; and soldering the housing and the second collimator by irradiating a soft beam to the solder. According to said method, since the contact portion between the housing and the collimator is soldered using a soft beam, a work time is shortened and a range of temperature to guarantee a stable operation increases, compared to the related art bonding process using epoxy.</p> |
