SAWING AND HANDLER SYSTEM FOR MANUFACTURING SEMICONDUCTOR PACKAGE

摘要

Disclosed is a sawing and handler system for manufacturing a semiconductor package. The system includes an on-loader unit, a sawing machine and a cleaning unit, which are sequentially aligned in the system so that the semiconductor strip or the semiconductor package sequentially passes through the on-loader unit, the sawing machine and the cleaning unit according to a process order thereof, thereby improving the sawing and processing speed of the system for the semiconductor strip.