发明名称 |
Semiconductor die attachment for high vacuum tubes |
摘要 |
There is described novel bonding and interconnecting techniques for use with semiconductor die for the creation of thermally efficient, physically compliant Ultra High Vacuum Tubes and the novel tube resulting therefrom. |
申请公布号 |
US2005253242(A1) |
申请公布日期 |
2005.11.17 |
申请号 |
US20040846060 |
申请日期 |
2004.05.14 |
申请人 |
INTEVAC, INC. |
发明人 |
COSTELLO KENNETH A.;RODERICK KEVIN J. |
分类号 |
B23K5/00;B23K31/02;H01L21/60;H01L23/053;(IPC1-7):H01L23/053 |
主分类号 |
B23K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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