发明名称 Apparatus and method for terminating probe apparatus of semiconductor wafer
摘要 A method and apparatus for terminating a probe that probes a semiconductor device with a signal cable from a tester is provided to connect layers of the probe to layers of the signal cable side by side. The probe and signal cable can be a co-axial or tri-axial probe and signal cable, respectively. A center conductive probe needle of the probe is disposed side by side with and electrically connects to a center signal conductor of the signal cable. A dielectric layer of the probe is disposed side by side with and connects to a dielectric layer of the signal cable. A conductive guard layer of the probe is disposed side by side with and electrically connects to a conductive dispersion/guard layer of the signal cable, and a sleeve of the probe is disposed side by side with and connects to a sleeve of the signal cable. In a tri-axial embodiment, a second dielectric layer of the probe is disposed side by side with and connects to a second dielectric layer of the signal cable.
申请公布号 US2005253612(A1) 申请公布日期 2005.11.17
申请号 US20050178952 申请日期 2005.07.11
申请人 发明人 ROOT BRYAN J.;FUNK WILLIAM A.
分类号 G01R1/073;(IPC1-7):G01R31/02 主分类号 G01R1/073
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