发明名称 |
METHOD AND SYSTEM FOR DEFLASHING MOLD COMPOUND |
摘要 |
A method and system for deflashing mold compound is provided. In one embodiment, a method for dislodging contaminants from an integrated circuit includes directing sublimating particles against a surface of the integrated circuit. Contaminants disposed on the surface of the integrated circuit are abraded with the sublimating particles to dislodge at least a portion of the contaminants.
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申请公布号 |
US2005255795(A1) |
申请公布日期 |
2005.11.17 |
申请号 |
US20040845559 |
申请日期 |
2004.05.13 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
SAID MOHD H.M. |
分类号 |
B24B1/00;B24C1/00;B24C3/12;B24C3/32;H01L21/00;H01L21/48;(IPC1-7):B24B1/00 |
主分类号 |
B24B1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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