DEVICE AND METHOD FOR CUTTING NONMETALIC SUBSTRATE

摘要

An apparatus for cutting a nonmetallic substrate (P) and method thereof are disclosed. The present invention is suitable for cutting upper and lower substrates (P) simultaneously or for cutting either an upper or lower substrate selectively in a manner of controlling a cutting depth by adjusting a focus position of a short wavelength laser beam in cutting various nonmetallic substrates (P) such as a glass substrate for fabricating a flat panel display such as TFT-LCD, PDP, OLED, etc. The present invention includes a laser beam generator (10) generating a UV short wavelength laser beam, a torch (6) applying the short wavelength laser beam to a specific location on the nonmetallic substrate to be cut, a focus moving means (8) for varying a focus location of the laser beam in a depth direction of the substrate, and a relative object moving means (3, 4) for allowing the substrate and the laser beam to make a relative movement to cut the substrate.