| 摘要 |
A method for forming a printed circuit board, and more particularly a method of forming a plated through hole (PTH), a blind via, and a buried via of printed circuit board. The method includes providing a two-layer board having a through hole therein, conformally forming a seed layer on the metal foil and in the through hole, forming a mask on the metal foil, having an opening aligned to the through hole to expose the seed layer on the through hole, forming a conductive layer on the exposed seed layer within the through hole, and removing the mask.
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