发明名称 Hygroscopic molding
摘要 The present invention provides a moisture-absorbent formed body comprising 1) an amine compound and/or a thermally conductive material, 2) a hygroscopic agent, and 3) a resin component, for removing moisture from within the sealed atmosphere of an organic electroluminescent device, and thereby suppressing the occurrence of dark spots.
申请公布号 US2005255285(A1) 申请公布日期 2005.11.17
申请号 US20030520444 申请日期 2003.07.07
申请人 UCHIBORI TERUO;OHYAMA KANETO;MIYAZAWA KENTARO;KAWAGUCHI YOHEI;MAKI HIDEHIKO;NAKAJIMA YUSUKE 发明人 UCHIBORI TERUO;OHYAMA KANETO;MIYAZAWA KENTARO;KAWAGUCHI YOHEI;MAKI HIDEHIKO;NAKAJIMA YUSUKE
分类号 H01L23/26;H01L51/52;(IPC1-7):H05B33/04;C09K3/00 主分类号 H01L23/26
代理机构 代理人
主权项
地址