DIP MOLDED ARTICLE WITH LOW SURFACE RESISTIVITY

摘要

The present invention relates to a dip molding having a low surface resistivity, the dip molding having a surface resistivity that is lower than that of a conventional product even after being washed with superpure water. The dip molding of the present invention has a surface resistivity, measured under an atmosphere of 20 DEG C and a relative humidity of 65%, of 10<7> to 10<10> OMEGA /square. Since the dip molding of the present invention has a low surface resistivity, it can suitably be used as a glove for precision electronic component production and semiconductor component production.